Technology Snapshot
Substrate Material:
Any
Size:
≤ 200 mm diameter (8 inches)
Substrate Thickness:
≥ 50 microns (2 mils)
Die Size:
≥ 200 x 200 µm (8 x 8 mils)
Tape Manufacturer:
ANY
Bumped Wafers, Ink Dots & Electronic Maps:
OK
Shipped Format:
Waffle Packs
Gel Packs
Frame to Frame
JEDEC
Trays