Technology Snapshot
Substrate: Any
Substrate Size: ≤ 200 mm diameter (8 inches)
Substrate Initial Thickness: ≤ 2 mm (80 mils)
Substrate Final Thickness: 50 microns (2 mils)
Die Size: ≥ 200 x 200 µm (8 x 8 mils)
Tape Type: UV or Non-UV
Tape Manufacturer: Any*
Shipped Format:
  1. Stretched Grip Ring
  2. Unstretched Dicing Frame

*SawStreet Standard Tapes

  • Lintec - Adwil D-628 (UV)
  • Ultron - 1042R-12 (UV)
  • Nitto - V-8S-R2 (non-UV)