Technology Snapshot
Substrate Material: Any
Size: ≤ 200 mm diameter (8 inches)
Substrate Thickness: ≥ 50 microns (2 mils)
Die Size: ≥ 200 x 200 µm (8 x 8 mils)
Tape Manufacturer: ANY
Bumped Wafers, Ink Dots & Electronic Maps: OK
Shipped Format:
  1. Waffle Packs
  2. Gel Packs
  3. Frame to Frame
  4. JEDEC Trays