SawStreet® is a privately owned quick turn semiconductor backend service provider. SawStreet's services include grinding, dicing, pick & place, and inspection. SawStreet is dedicated to providing the highest quality service and finding unique solutions to customer's more demanding requirements.
|Grinding - SawStreet manages grinding (thinning) services both internally and through service partners. SawStreet has the ability to provide quick turn services on thinning wafers or individual die.|
|Dicing - SawStreet uses both ADT and Disco dicers in our cleanroom. SawStreet has extensive experience dicing wafers as thin as 50um. SawStreet also does extensive Pizza Mask dicing and subcutting.|
|Die Sorting - SawStreet's uses both Royce and ASM semi-automated and automated pick and place equipment which ensures the highest quality pick.|
|Inspection - SawStreet performs commericial inspection for a wide variety of customers. The ability to visually inspect a circuit requires a lot of skill and training which increases through experience and a continuous training program.|