SawStreet runs five ADT and Disco dicing machines — 2″ and 4″ spindle — giving us the flexibility to match the right blade, feed, and spindle recipe to each substrate and thickness. We dice wafers up to 300 mm and as thin as 25 µm, where handling and chip-out control separate a good result from a scrapped lot.
Beyond standard whole-wafer singulation, SawStreet specializes in pizza-mask dicing, subcutting, wafer coring, and optical/glass dicing — indexing across a multi-project wafer to recover exactly the die and sections each customer needs.
Every job is characterized to the customer's substrate and tolerance. Representative limits across the fleet:
| Parameter | Capability |
|---|---|
| Substrates | GaAs · InP · SiGe · GaN · SiC · more |
| Wafer diameter | Up to 300 mm |
| Wafer thickness | 25 µm – 7 mm |
| Smallest die | 180 µm × 190 µm |
| Saw street width | As small as 30 µm |
| Wafer backside | Bare · full metal · patterned |
| Dicing machines | 5 — ADT 7100/7200 · DAD3240/3360 · ADT 7134 (4″) |
For wafers prone to backside chipping or cracking, DBG reverses the conventional order: we dice to a depth greater than the final thickness (trenching), then grind the wafer down until the die singulate. The thinned wafer is mounted to tape and the backgrind tape removed — yielding cleaner die edges on fragile substrates.
Powered by an ADT 4″ spindle, we deliver high-precision 300 mm wafer coring for wafer resizing. Our high-torque spindle provides the stability needed to perform clean, low-damage circular core extractions and re-sizing across silicon, glass, and specialty materials with exceptional yield and edge quality.