The tools behind every SawStreet order — grinding, dicing, die sort, and inspection equipment, matched to your substrate and tolerance.
Five ADT and Disco saws on 2″ and 4″ spindles — wafers up to 300 mm and as thin as 25 µm, plus pizza-mask dicing, subcutting, optical/glass dicing, and wafer coring. See dicing →
Up to 8″ × 8″ (200 mm) products — silicon wafers, thin-film devices, high-brightness LED, packages, SAW filters, glass/silicon sensors, GaAs, GaN/SiC, PZT and more.
Up to 8″ × 8″ products with cassette load and auto-clean — silicon wafers, thin-film devices, high-brightness LED, packages, SAW filters, glass/silicon sensors, PZT.
A 1.8 kW high-output spindle processes a wide range of materials, from silicon to difficult-to-process materials like ceramics.
Cuts not only silicon wafers but a variety of sizes and materials — large package substrates and electronic parts including SAW filters, and more.
Up to 12″ round product, 12″ × 9″ square substrates with frame or 12″ × 12″ chuck without frame. Ceramic substrates, alumina, hybrids, thick-film devices and more. Also drives 300 mm wafer coring.
Fully and semi-automated pick & place with full die traceability — die down to 180 × 190 µm and 50 µm ultra-thin GaAs, into waffle packs, Gel-Paks, grip rings, frames, Tape & Reel, and custom trays. See die sort →
120 ms cycle time (net 30K UPH). Latest motion technology with a direct-couple bond head and dual-arm pick-and-place. Output to frames, rings, Gel-Pak.
120 ms cycle time (net 30K UPH). Direct-couple bond head with dual-arm pick-and-place; output to frames and rings.
Fully automated single-head die-sorting system with an optional inverter — up to 6,000 DPH throughput at ±15 µm accuracy.
Automated die sorter for medium-volume / high-mix applications. Handles wafers up to 300 mm (12″) and excels at die-sort applications for sensitive die.
Automated die sorter for medium-volume / high-mix applications. Handles wafers up to 200 mm (8″) and excels at die-sort applications for sensitive die — we run multiple MP 300 (8″) units for added capacity.
Straightforward pick-and-place for die from sawn or scribed wafers on adhesive film — into waffle packs, Gel-Pak, film frame, or directly onto substrates.
Backside thinning and ultra-thinning to low profiles, held to ±10 µm with surfaces to Ra 0.009 µm. See grinding →
Handles 200 mm and 300 mm wafer thinning on a single high-flexibility spindle with an in-process height gauge for live thickness monitoring. Also supports frame grinding and individual die thinning, holding accuracy within 10 µm.
A second DAG 810 dedicated to 200 mm wafer thinning, with the same in-process height gauge and ±10 µm accuracy — adding grinding capacity for quick-turn work.
Automated (AOI) and manual visual inspection to MIL-STD-883 or customer-specific standards, with defect-category tracking and full reporting. See inspection →
Automated optical inspection (AOI) for repeatable defect detection.
Automated optical inspection (AOI) for repeatable, high-throughput defect detection.
Digital microscopy and measurement for detailed review, imaging, and dimensional checks.
Tell us about your substrate and process — our team will confirm the right equipment and recipe for your job.
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