SawStreet sorts diced wafers or previously sorted parts using fully automated and semi-automated pick-and-place tools, transferring good die directly into customer-specified carriers. We handle die as small as 180 × 190 µm and as thin as 25 µm — including devices with extremely fragile topside surfaces.
Wafer-map-driven picking ensures 100% traceability from original wafer position to final carrier, while automated binning keeps known-good die and rejects cleanly labeled and separated.
| Parameter | Capability |
|---|---|
| Equipment | Royce · ASM · DTS · V-Tek (semi- & fully-automated) |
| Smallest die | 180 µm × 190 µm |
| Thinnest die | down to 25 µm |
| Mapping | Pick to wafer map (traceable) |
| Output carriers | Waffle pack · Gel-Pak · grip ring · frame · Tape & Reel · custom trays |
We deliver sorted die in the format your downstream process expects — waffle packs and Gel-Paks for tray handling, grip rings and frames for tape-mounted die, Tape & Reel for automated assembly, and custom trays on request. Tell us your carrier and we'll set the recipe to match.