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SawStreet LLC
Quick turn grinding supports up to 200mm diameter wafers and the ability to thin a wide variety of substrates.
SawStreet also has the capability to thin reticles or single die.
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SawStreet uses both ADT and Disco Dicing equipment.
SawStreet has extensive experience dicing wafers as thin as 50um. SawStreet also does extensive Pizza Mask dicing and subcutting.
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SawStreet's uses both Royce and ASM semi-automated and automated pick and place equipment. SawStreet can pick die as thin as 50 um thick and as small as 180um x 250um to waffle pack, gel-pak, frame and grip rings.
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SawStreet performs commericial inspection for a wide variety of customers. The ability to visually inspect a circuit requires a lot of skill and training which increases through experience and a continuous training program.
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SawStreet is registered with the US Department of State and handles products covered under the International Traffic in Arms Regulations (ITAR).