SawStreet is a privately owned, quick turn semiconductor backend service provider — grinding, dicing, pick & place, and inspection — engineered for the demanding tolerances of defense, aerospace, and RF.
From full 300 mm wafers to single die and pizza masks requiring multiple subcuts, SawStreet delivers a custom, quick turn solution — on time.
01 — GRINDBackside thinning to ultra-low profiles — full wafers, bumped wafers, reticles, and single die. Up to 300 mm, including Dice Before Grind.
02 — DICEFive ADT and Disco saws, 2″ and 4″ spindle — wafers as thin as 25 µm, up to 300 mm and 7 mm thick, plus pizza-mask dicing, subcutting, and wafer coring.
03 — SORTFully and semi-automated pick & place with full die traceability to waffle packs, Gel-Paks, grip rings, frames, Tape & Reel, and custom trays — die down to 180 × 190 µm, 50 µm ultra-thin GaAs, and bumped devices.
04 — INSPECTAutomated (AOI) and manual visual inspection to MIL-STD-883 or customer-specific standards — with comprehensive inspection tracking and full quality reporting.
Spin coating for specialized dicing requests.
300 mm capable — resizing or downsizing wafers for post-processing.
Backside die laser marking — high-resolution even on the smallest die.
Secure, climate-controlled storage for wafers and bare die.
SawStreet meets the compliance and quality standards required by defense, aerospace, and security customers.
Certified supplier, audited by DEKRA. Certificate valid through May 24, 2027.
View certificate ↗Registered with the U.S. Department of State; handles products covered under the International Traffic in Arms Regulations.
View registration (redacted) ↗A certified Service-Disabled Veteran-Owned Small Business — founded by a West Point graduate.
Status letter ↗Send us your wafer specs and turn requirements. We'll come back with a custom solution tailored to meet your needs — and deliver it on time.
