Contact InfoSawStreet LLC
Quick turn grinding supports up to 200mm diameter wafers and the ability to thin a wide variety of substrates.
SawStreet also has the capability to thin reticles or single die.Information
SawStreet uses both ADT and Disco Dicing equipment.
SawStreet has extensive experience dicing wafers as thin as 50um. SawStreet also does extensive Pizza Mask dicing and subcutting.Information
SawStreet's uses both Royce and ASM semi-automated and automated pick and place equipment. SawStreet can pick die as thin as 50 um thick and as small as 180um x 250um to waffle pack, gel-pak, frame and grip rings.Information
SawStreet performs commericial inspection for a wide variety of customers. The ability to visually inspect a circuit requires a lot of skill and training which increases through experience and a continuous training program.Information
SawStreet is an ISO certified supplier. Click Here for a copy of the certificate.
SawStreet is registered with the US Department of State and handles products covered under the International Traffic in Arms Regulations (ITAR).
SawStreet is a certified Service Disabled Veteran Owned Small Business (SDVOSB).